In copper plating, a current of 0.5A is allowed for cathode area of 100cm². If this current is maintained constant for 100 minutes, the thickness of the copper deposited will be approximately (the electrochemical equivalent of copper = 0.0003g/^oC, density of copper = 10^-4g/cm³ )

• A.10^-2mm
• B.10^-3mm
• C.10^-4mm
• D.10^-5mm
• E.10^-6mm